Manufacturing Process -1st stage

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Bare PCB 
Solder paste applied for specification of
surface mount component.
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Screen printer machine for solder paste
application
Loading on pick & place M/C PBC feeding
into automatic pick & place M/C.



Manufacturing Process -2nd stage



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Component placement (automatic
component controlled pick & place).

To reflow oven (feeding PCB with loose
component for soldering).
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Reflow oven (automatic components
controller SHT soldering process.)
Soldered card.


Manufacturing Process -3rd stage


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Through hole component placement
(static safe wrist band for component
safety for reducing damage via static
charge.)
Fail safe poke yoke system of correct
components and location.
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Wave soldering( through hole components).
Ultra sonic cleaning (for flux and
residual removal).



Manufacturing Process -4th stage


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Testing of card
Environmental test chamber
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Wire harness [DTFE cable( Teflon
cable,flet ribben cable)]
Assembly of display



Manufacturing Process -5th stage

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System jig for testing (computer final test).
System jig for final testing
  1. Functional test
  2. Wiring test
  3. Final test
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Endurance testing (24 hrs. as per
international standard)
Edurance testing & moving parts(72 hrs.)
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